Banks and Blackstone line up $63 billion to finance Broadcom chips for Anthropic to lease

Bank of America, Blackstone, Citi and Morgan Stanley will provide $63 billion in financing to buy Broadcom AI chips and networking gear for Anthropic, in one of the largest debt deals tied to the AI buildout. The transaction runs through a newly formed special purpose vehicle, which will purchase Broadcom's XPU AI accelerators and networking equipment and lease them to Anthropic. Bank of America, Citi and Morgan Stanley are arranging the first lien financing, Blackstone will provide the committed portion of the second lien financing, and Broadcom will provide residual value support to the new entity equal to the first lien portion.

Deliveries are expected to begin in 2027 under Broadcom's existing strategic compute capacity agreement with Anthropic. The deal follows a prior $35 billion Apollo and Blackstone capacity financing for Anthropic under the same Broadcom agreement, and it was announced on October 26, 2026, hours after Anthropic publicly unveiled its initial public offering filing.

Sources: Reuters via WEVE; Dow Jones via Morningstar